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Fennell - PCB Designer - Los Angeles, CA, USA

Lance Fennell

Los Angeles, CA, USA

Services

PCB Designer

  • Full time
  • Part time
  • One time
  • Contract
  • Temp

Summary:

I have over 20 years of experience as a Design engineer, with expertise in PCB development and hardware creation and test. At many of my previous positions, I was responsible for the generating schematics, layout of PCBs boards, 3D modeling of enclosures, cabling, management of support vendors, all 2D /3D documentation for hardware

Work History

Zodiac Aerospace

From February 2012

2/2013- 7/2013
• Designed digital, analog and high-speed circuits. In support, custom power and communication modules for commercial Aircraft and variable speed motor controls, to support water and waste and vacume.Many of these systems and sub-systems are used in military, communications, medical, industrial, markets worldwide.
• Generated schematics, performed printed circuit board layout, and processed ECO's, DCN's ADCN's
• Board design technologies include multi- layer PCB's up to 12 layers, differential pairs with matched impedance, split planes and high density BGA, down to .05mm pitch spacing and 3mil etch buy 3mil spacing.

Source Scietific

April 2012 - September 2012

• Designed digital, analog and high-speed circuits. In support of the custom medical industry.
• Generated schematics performed printed circuit board layout, processed ECO's, test and debug boards.
• Board design technologies include multi- layer PCB's up to 12 layers, differential pairs with matched impedance, split planes and high density BGA, down to .05mm pitch spacing and 3mil etch buy 3mil spacing.

California Institute of Technology

September 2009 - February 2012

Designed digital, RF analog and high-speed circuits. In support
Laser Interferometer Gravitational Wave Observatory and the National Science Foundation
• Managed design migration from many design platforms in support of new design technology direction, and design flow and documentation including drawing, Bom, and electronic models.
• Designed and build 3D models of custom rack mount hardware, wire harness, cables and enclosures documentation drawings for vendor bids.
• manage vendor quality of the hardware electronics and solved technical problems with build process of systems , sub-systems, enclosures , cables , and paneling.
• Board design technologies include multi- layer PCB's up to 12 layers, differential pairs with matched impedance, flex boards, split planes and high power boards and thermal management.

FutureLogic Inc

August 2009 - September 2009

• Designed digital, analog and high-speed circuits. In support of customized printer solutions for a wide range of applications, including casino/gaming vouchers, gas pump receipts, medical devices, RTAL, POS coupons, and labels for assembly-line products.
• Managed design migration from many design platforms in support of new design technology direction, and design flow.
• Board design technologies include multi- layer PCB's up to 12 layers, differential pairs with matched impedance, split planes and high density BGA, down to .05mm pitch spacing and 3mil etch buy 3mil spacing.

Sr. PCB design Engineer

Curtiss Wright Embedded Computing

April 2009 - July 2009

• Designed digital, analog and high-speed circuits. In support of high power and communication modules control sub -systems, military.
• Managed design migration from many design platforms in support of new design technology direction, and design flow.
• Board design technologies include multi- layer PCB's up to 12 layers, differential pairs with matched impedance, split planes and high density BGA, down to .05mm pitch spacing and 3mil etch buy 3mil spacing.

Sr. PCB design Engineer

Space Exploration, Hawthorne

September 2008 - January 2009

• Designed digital, analog and high-speed circuits. In support of Rigid flex, Hybrid microcircuits, custom power and communication modules for commercial rocket delivery and control sub -systems, military, computer, communications, medical, industrial, and instrumentation markets worldwide.
• Generated schematics, performed printed circuit board layout, and processed ECO's, DCN's ADCN's
• Board design technologies include multi- layer PCB's up to 12 layers, differential pairs with matched impedance, split planes and high density BGA, down to .05mm pitch spacing and 3mil etch buy 3mil spacing.
• Board design technologies included multi- layer PCB's up to 20 layers , micro vias, flex PCBs up to 10 layers, differential pairs with matched impedance, multiple layer split mixed planes, high density SMT, DDR-2 memory, QFP and BGA, down to .05mm pitch spacing and 3mil etch buy 3mil spacing.

Sr. PCB design Engineer

Bi Technologies Corp

February 2007 - September 2008

• Designed digital, analog and high-speed circuits. In support of Hybrid microcircuits, custom power and communication modules for automotive encoder steering sensors, military, computer, communications, medical, industrial, and instrumentation markets worldwide.
• Generated schematics, perform printed circuit board layout, and process ECO's, DCN's ADCN's
• Board design technologies include multi- layer PCB's up to 12 layers, differential pairs with matched impedance, split planes and high density BGA, down to .05mm pitch spacing and 3mil etch buy 3mil spacing.
• Board design technologies included multi- layer PCB's up to 20 layers , micro vias, flex PCBs up to 10 layers, differential pairs with matched impedance, multiple layer split mixed planes, high density SMT, QFP and BGA, down to .05mm pitch spacing and 3mil etch buy 3mil spacing.

Sr. PCB design Engineer

Panasonic Avionics

June 2006 - January 2007

• Designed digital, analog and high-speed circuits. In support of the in flight entertainment and communication, and control systems.
• Generated schematics, perform printed circuit board layout, and process ECO's, DCN's ADCN's
• Board design technologies include multi- layer PCB's up to 12 layers, differential pairs with matched impedance, split planes and high density BGA, down to .05mm pitch spacing and 3mil etch buy 3mil spacing.
• Board design technologies included multi- layer PCB's up to 20 layers, micro vias, flex PCBs up to 10 layers, differential pairs with matched impedance, multiple layer split mixed planes, high density SMT, QFP and BGA, down to .05mm pitch spacing and 3mil etch buy 3mil spacing.

Sr. PCB design Engineer

Irvine Sensors

August 2005 - June 2006

• Designed digital, analog and high-speed circuits 30Ghz. In support of the custom military, commercial and aerospace industry.
• Generate and update schematics, perform printed circuit board layout, process ECO's, test and debug boards.
• Created and supported the layout library symbols for integration of the Mentor Graphics design path. Converted older designs to conform to IPC guidelines and design for test /manufacturing practices.
• Built and support the schematic and layout library for CAD tools. Lead design revisions of PCB development and documentation control issues.
• Provided PCB manufacture with all sporting design files such as Gerber, Fabrication and assembly drawings.
• Managed assembly build house with build of materials and part placement materials and special instructions related to product build.
• Board design technologies included multi- layer PCB's up to 20 layers, micro Vias, flex PCBs up to 10 layers, differential pairs with matched impedance, multiple layer split mixed planes, high density SMT, QFP, DDR-2 memory and BGA, down to .05mm pitch spacing and 3mil etch buy 3mil spacing.

Design Engineer

Data Spectrum

• Designed digital, analog and high-speed circuits. In support of the custom medical, commercial and aerospace industry.
• Generated schematics performed printed circuit board layout, processed ECO's, test and debug boards.
• Created and supported the layout library symbols for integration of the view logic to pads design path. Converted older designs to conform to IPC, Data Spectrum guidelines and design for test /manufacturing practices.
• Built and supported the schematic and layout library for CAD tools. Lead design revisions of PCB development and documentation control issues.

Design Engineer

HARRIS CORPORATION

• Designed digital, analog and high-speed RF circuits in the 38 Giga hertz range. Supporting the development G3 telecommunication infrastructures and signal distribution.
• Generated schematics, performed printed circuit board layout, processed ECO's, test and debug boards.
• Created and support the layout library symbols for integration of the viewlogic to pads design path. Converted older designs to conform to IPC, Harris guidelines and design for test /manufacturing practices.
• Built and support the schematic and layout library for CAD tools. Lead design revisions of PCB development and documentation control issues.
• Trained up to 15 personnel on the use of new tools and features. Participate in the implementation of the generation of a common design practices for the Harris design engineering group

Sustaining Engineer

Rockwell Collins

• Supported In flight entertainment system for the following clients, Boeing, Virgin air, TWA.
• Designed and modified existing systems and sub systems for cost reduction. Managed inside resources and outside vendors including Newark electronics and others like to obtain obsolete parts, maintain schedules and delivery times to production.
• Tested hardware/software performed system integration/testing, documented and delivered video server systems and subsystems to production.
• Successfully updated the cassette recorder designed from through-hole devices to surface mount components. Built and tested prototype interface cables and concept boards to prove design concept

System Application Engineer

PHOTOBIT CORPORATION

Developed CMOS Image sensors development systems
• Designed and developed reference design circuits for development systems and evaluation of the CMOS image sensor research and technology. Designs included digital, analog and high-speed circuits in the 2 mega pixel down to 1k pixel in size and in varying interface requirements to OEM systems. Generated schematics, performed printed circuit board layout, processed the boards, tested and debugged boards.
• Created and built image sensor demonstration systems that provided a revenue stream for the company as well as concept boards for testing and characterization of the image sensors.
• Supported statewide customers in concepts, hardware features, and software tools. In the set-up and creation of systems and sub-systems.

Proto-type Engineer

XEROX CORPORATION

• Developed New ROS read only scanners/ printers. Designed and developed prototype circuits for research and technology ROS laser group. Designs included digital, analog and high speed RF circuits in the 1 Giga hertz range. Generated schematics performed printed circuit board layout, processed, tested and debugged boards.
• Designed and built experimental concept of USB application in a scanner.
• Proved concept of I2c communication protocol in a raster scanner design.

Qualifications & Certifications

moriningside high, inglewood ca

moriningside high, inglewood ca

Industrial Electronics/ AS Computer Technology

El Camino College

Electrical Engineering / Computer Science

California State University Northridge

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