Harris - PCB Board Design - Gaithersburg, Maryland, USA

Kyle Harris

Gaithersburg, Maryland, USA

Services

PCB Board Design

Summary:

SKILLS:
• Designing Printed Board for RF, Digital, Microwave
• Designing per IPC 4101, IPC-A-610 and IPC Standards
• IPC Certification training
• Mentor Graphics PADS 9.3.1 AutoRouter Experience
• Board Processing with ECAM350
• AutoCAD 2008, 2011 and Mentor Graphics Blueprint for Documentation
• Schematic creation and capture with DxDesigner
• Cadence Orcad 16.3 and Eagle Schematic Capture
• Solidworks 2012
CERTIFICATIONS & TRAINING:
• Microprocessor Technology Certificate
• Microsoft Office Certification
• Mentor Graphics PowerPCB layout and AutoRoute, DxDesigner Schematic
• IPC Training for IPC-4101, 2221, IPC-A-610and IPC-A-600
• DDI training - Printed Circuit Design for Manufacturing Processes
• Signal Integrity Courses for EMI through Designer Council
• Solidworks Essential Training TriMech Columbia Md
• Altium Designer

Work History

Printed Circuit Designer

DRS Technologies (Contractor - Aerotek)

November 2012 - November 2013

• Board design for Engineering services at DRS with Mechanical Engineering department.
Designing RF boards, Test Fixtures and Engineering change orders that involves PCB design.

• Matt Robinettes RF Reference Design; 10 layer RF board; PCI connectors; Differential pair matching;
Daughter Card (xPico) assembly incorporated into Board design; Parts creation from Datasheets; Complex design with multiple isolated compartments; Gore gaskets for isolations. I worked from a finish Engineering schematic and illustrated block diagram for parts placement.

• Matt Robinettes Test Fixture which align with RF Reference for Testing: Triplexor circuitry; Differentail pairs; Grid connector pattern for testing; RF shielding per Engineering spec; PCI connector alignments.
• Adrian Gilberts TST project: 14 layer RF Board with 144 pin BGA chip; Differentail pair matching; Complex design with isolated compartments; Form in place gasketing; Blind vias; Cable routing on PCB using clips; Multilayer board with parts on both sides.
• Pico-Transceiver Design: Multi – 14 layer RF board with FPGA and 144 pin BGA chip; Blind vias; Complex design with isolated compartments; Using form in place gasketing for isolations; Differential pairs match length; high-density layout; Components on both sides

Projects

•Pico-Transceiver Design

Multi – 14 layer RF board with FPGA and 144 pin BGA chip; Blind vias;
Complex design with isolated compartments; Using form in place gasketing for isolations; Differential pairs match length; high-density layout; Components on both sides

•Adrian Gilberts TST project

14 layer RF Board with 144 pin BGA chip; Differentail pair matching;
Complex design with isolated compartments; Form in place gasketing; Blind vias; Cable routing on PCB using clips; Multilayer board with parts on both sides.

• Matt Robinettes RF Reference Design

10 layer RF board; PCI connectors; Differential pair matching;
Daughter Card (xPico) assembly incorporated into Board design; Parts creation from Datasheets; Complex design with multiple isolated compartments; Gore gaskets for isolations. I worked from a finish Engineering schematic and illustrated block diagram for parts placement.

Qualifications & Certifications

AutoCadd

Montgomery College

Drafting /Design

Arundel Institute of Technology, Baltimore, MD

Art Education

University of Maryland Eastern Shore

Princess Anne Md

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